China’s Capcon Semiconductor raises $50m

// Capcon is an equipment manufacturer that provides products and solutions to the advanced semiconductor assembly and packaging industry. Its solutions include flip-chip bonders, chip-on-wafer bonders, package-on-package bonders, stack die bonders, panel-level die bonders, multi-chip die bonders and more. The company was founded in 2014 and is based in Hong Kong. https://www.avcj.com/avcj/news/3028477/china-s-capcon-semiconductor-raises-usd50m //

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